1.2.4 Revision History
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1.2.4 Revision History
Section titled “1.2.4 Revision History”Table 10: Revision History
| Reference | Changes to Previous Version | Comment |
|---|---|---|
| V1.5.0 | ||
| Page 14 | Changed for TC33xEXT the number of EVADC converters and channels. Primary converters changed from 4/32 to 6/40 and secondary converters from 2/32 to 0/0. | |
| Page 15 | Corrected for TC33x the GTM configuration of SPE from 0 to 2, of “BRC / DPLL” from “0 / 0” to “1 / 0”, of “CMP / MON” from “0 / 0” to “1 / 1”, of “DTM modules” from “4” to “6 (4 on TOM, 2 on ATOM)”, of “TBU channels” from “2 (TBU0-1)” to “3 (TBU0-2)”. | |
| Page 15 | Removed GTM from TC33xEXT (all GTM features set to 0). | |
| Page 15 | Corrected number of CDTM modules of GTM from 6 to 7 for TC39x. Corrected number of CDTM modules of GTM from 5 to 6 for TC38xEXT. Correct the assignment of DTM modules of GTM from “10 on TOM, 10 on ATOM” to “8 on TOM, 12 on ATOM” for TC38xEXT. | |
| Page 15 | Removed FlexRay from TC33xEXT. | |
| Page 16 | Changed number of ASCLIN from 12 to 6 for TC33xEXT. | |
| Page 16 | Changed number of CAN modules from 2 to 1 and consequently the number of CAN nodes from “2x4” to “1x4” for TC33xEXT. | |
| Page 11, 19-26 | Changed in all block diagrams the text in the EVADC sub-blocks. | |
| V1.5.1 | ||
| Page 17 | Extended the footnote on AGBT explaining its availability. | |
| Page 15 | Changed configuration of GTM of TC33x. Changed from 2 clusters at 100 MHz to 2 clusters at 200 MHz. | |
| Page 16 | Changed documented configuration of SENT of TC39x from “25 + 5 by SW” to “25”. | |
| – | Changed throughout the document the name of the device TC38xEXT to TC3Ex. | |
| Page 14, 16 | Added footnotes to TC3Ex features EVADC, EDSADC, SENT, MSC. | |
| V1.6.0 | ||
| Page 12 | Added the TC3Ax Feature list to the Table 9. | |
| Page 12 | Added the TC3Ax Block Diagram. | |
| Page 27 | Added TC3Ax to the Device Series list. | |
| Page 27 | Added “80 pins” and “233 pins” in “Package class” options. | |
| Page 12 | Added the row “Power Management System” to the Platform Feature Overview- Table 9. | |
| – | FlexRay for the TC3Ax is not available. | |
| Page 2 | Table 1 ‘Note’ description updated for DAM RAM. | |
| Page 1 | Update kbit, Mbit definitions to kbit/s and Mbit/s respectively. | |
| V1.6.1 | ||
| Page 12 | Update the TC3Ax Block Diagram and the Feature List Table with the BITMGR0. | |
| Page 29 | In chapter 1.2.3.3 removed the wording ‘Reduced’ and replaced with ‘Feature variants of the general TC32x device may be created’. | |
| Page 12 | Updated the TC3Ax Block Diagram with the XBAR2 and CPU2 DSPR size. | |
| Page 12 | Updated the CPU2 DSPR Size for TC3Ax in “Platform Feature Overview” - Table 9. | |
| V1.6.2 | ||
| Page 12 | Updated Platform Feature Overview- Table 9 with TC33x EVADC Secondary Groups / Channels to 2 /28. | |
| Page 27 | Definition of “Feature Package” - “X” is updated. | |
| Page 12 | Updated the Feature ‘Packages’ to include BGA216 package support for TC3Ax. | |
| V1.6.3 | ||
| Page 12 | TC3Ax reference is removed in this section. | |
| Page 12 | Updated Platform Feature Overview- Table 9. References to TC3Ax are removed. | |
| Page 12 | TC3Ax Block Diagram removed. | |
| Page 27 | TC3Ax references removed. | |
| V1.6.4 | ||
| Page 29 | Section 1.2.3.3 - Table-10 - TC32x Feature Overview delta to TC33x is removed and a reference to Data Sheet addendum document added. | |
| Page 12 | Section 1.2.2 - Table-9 - at Feature “Packages” the row for “Bare Die” and respective foot note are removed. |